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  •   University of Thessaly Institutional Repository
  • Επιστημονικές Δημοσιεύσεις Μελών ΠΘ (ΕΔΠΘ)
  • Δημοσιεύσεις σε περιοδικά, συνέδρια, κεφάλαια βιβλίων κλπ.
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  •   University of Thessaly Institutional Repository
  • Επιστημονικές Δημοσιεύσεις Μελών ΠΘ (ΕΔΠΘ)
  • Δημοσιεύσεις σε περιοδικά, συνέδρια, κεφάλαια βιβλίων κλπ.
  • View Item
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GemFI: A fault injection tool for studying the behavior of applications on unreliable substrates

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Author
Parasyris, K.; Tziantzoulis, G.; Antonopoulos, C. D.; Bellas, N.
Date
2014
DOI
10.1109/DSN.2014.96
Keyword
cycle accurate
fault-injection
full system
simulation
Computer networks
Information systems
Architectural levels
Cycle-accurate simulation
Fault injection
Full system simulators
Network of workstations
Substrates
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Abstract
Dependable computing on unreliable substrates is the next challenge the computing community needs to overcome due to both manufacturing limitations in low geometries and the necessity to aggressively minimize power consumption. System designers often need to analyze the way hardware faults manifest as errors at the architectural level and how these errors affect application correctness. This paper introduces GemFI, a fault injection tool based on the cycle accurate full system simulator Gem5. GemFI provides fault injection methods and is easily extensible to support future fault models. It also supports multiple processor models and ISAs and allows fault injection in both functional and cycle-accurate simulations. GemFI offers fast-forwarding of simulation campaigns via check pointing. Moreover, it facilitates the parallel execution of campaign experiments on a network of workstations. In order to validate and evaluate GemFI, we used it to apply fault injection on a series of real-world kernels and applications. The evaluation indicates that its overhead compared with Gem5 is minimal (up to 3.3%), whereas optimizations such as fast-forwarding via check pointing and execution on NoWs can significantly reduce simulation time of a fault injection campaign. © 2014 IEEE.
URI
http://hdl.handle.net/11615/32039
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