Πλοήγηση ανά Θέμα "Multi-segment"
Αποτελέσματα 1-2 από 2
-
Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections
(2021)Traditional methods that test for electromigration (EM) failure in multisegment interconnects, over the lifespan of an IC, are based on the use of the Blech criterion, followed by Black’s equation. Such methods analyze ... -
A novel semi-analytical approach for fast electromigration stress analysis in multi-segment interconnects
(2022)As integrated circuit technologies move below 10 nm, Electromigration (EM) has become an issue of great concern for the longterm reliability due to the stricter performance, thermal and power requirements. The problem of ...