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dc.creatorFloros G., Evmorfopoulos N., Stamoulis G.en
dc.date.accessioned2023-01-31T07:38:08Z
dc.date.available2023-01-31T07:38:08Z
dc.date.issued2018
dc.identifier10.1109/SMACD.2018.8434858
dc.identifier.isbn9781538651520
dc.identifier.urihttp://hdl.handle.net/11615/71618
dc.description.abstractEfficient full-chip thermal simulation is among the most challenging problems facing the EDA industry today, due to the need for solution of very large systems of equations that require unreasonably long computational times. However, in most cases, temperature is not required to be computed at every point of the IC but only at certain hotspots, in order to assess the circuits compliance with thermal specifications. This makes the thermal analysis problem amenable to Model Order Reduction (MOR) techniques. System-theoretic techniques like Balanced Truncation (BT) offer very reliable bounds for the approximation error, which can be used to control the order and accuracy of the reduced models during creation, at the expense of greater computational complexity to create them. In this paper, we propose a computationally efficient low-rank BT algorithm that retains all the system-theoretic advantages in the reduction of model order for fast hotspot thermal simulation. Experimental results demonstrate a 39X order reduction and very tight accuracy bounds. © 2018 IEEE.en
dc.language.isoenen
dc.sourceSMACD 2018 - 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Designen
dc.source.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-85052541944&doi=10.1109%2fSMACD.2018.8434858&partnerID=40&md5=ffa9abeb37c61e5bcdc49cbcc39ab8c3
dc.subjectThermoanalysisen
dc.subjectApproximation errorsen
dc.subjectBalanced truncationen
dc.subjectComputational timeen
dc.subjectComputationally efficienten
dc.subjectModel order reductionen
dc.subjectOrder reductionen
dc.subjectThermal simulationsen
dc.subjectVery large systemsen
dc.subjectIntegrated circuit manufactureen
dc.subjectInstitute of Electrical and Electronics Engineers Inc.en
dc.titleEfficient Hotspot Thermal Simulation Via Low-Rank Model Order Reductionen
dc.typeconferenceItemen


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