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dc.creatorLekakis, I.en
dc.creatorKattis, M. A.en
dc.creatorProvidas, E.en
dc.creatorKalamkarov, A. L.en
dc.date.accessioned2015-11-23T10:37:36Z
dc.date.available2015-11-23T10:37:36Z
dc.date.issued2000
dc.identifier10.1016/s1359-8368(99)00058-x
dc.identifier.issn1359-8368
dc.identifier.urihttp://hdl.handle.net/11615/30237
dc.description.abstractA general solution to the thermoelastic and heat conduction problems for composite materials with curvilinear partially bonded inclusions is obtained. The solution of these problems is based on the complex potential method, conformal mapping and analytic continuation techniques. The obtained general solution is applied to the special case of an elliptical inclusion with the uniform heat flux applied to the matrix at infinity. As in the case of mechanical loadings, the crack-tip stress field possesses the square-root singularity with the logarithmic oscillation. in the special case of a line rigid inclusion, the order of singularity changes as the crack tip approaches the end of the inclusion. The thermal stress intensity factor at the crack tip is determined and numerical results an obtained for the case of an elliptical rigid inclusion. (C) 2000 Elsevier Science Ltd. All rights reserved.en
dc.sourceComposites Part B-Engineeringen
dc.source.uri<Go to ISI>://WOS:000086158800003
dc.subjectpartially bonded inclusionsen
dc.subjectINTERFACE CRACKen
dc.subjectANTIPLANE DEFORMATIONen
dc.subjectEngineering, Multidisciplinaryen
dc.subjectMaterials Science, Compositesen
dc.titleThe disturbance of heat flow and thermal stresses in composites with partially bonded inclusionsen
dc.typejournalArticleen


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