dc.creator | Antonetti, P. | en |
dc.creator | Flitris, Y. | en |
dc.creator | Flamant, G. | en |
dc.creator | Hellio, H. | en |
dc.creator | Gauthier, D. | en |
dc.creator | Granier, B. | en |
dc.date.accessioned | 2015-11-23T10:22:30Z | |
dc.date.available | 2015-11-23T10:22:30Z | |
dc.date.issued | 2004 | |
dc.identifier | 10.1016/j.jhazmat.2003.12.013 | |
dc.identifier.issn | 0304-3894 | |
dc.identifier.uri | http://hdl.handle.net/11615/25660 | |
dc.description.abstract | This paper presents experimental results dealing with a process for recovering copper in the scrap composite materials issued from electronic laminas industry. This environment-friendly process consists in the thermal treatment of scrap in a fluidized bed whose particles fix the harmful gases emitted by the organic glue gasification. A series of experiments was carried out in a thermobalance, coupled to FTIR spectrometer and GC/MS with small lamina samples. These experiments demonstrated the thermal behavior of scrap composite materials, and identified the major degradation reaction gases. A series of experiments was performed with bigger scrap samples hung in a laboratory-scale fluidized bed coupled to FTIR and MS, at 350degreesC; the results confirmed those obtained in thermobalance. Experiments showed that a residence time lasting less than 5 min is sufficient to recover the metallic copper, and exhaust gases are not harmful. (C) 2004 Elsevier B.V. All rights reserved. | en |
dc.source | Journal of Hazardous Materials | en |
dc.source.uri | <Go to ISI>://WOS:000221517000006 | |
dc.subject | degradation products | en |
dc.subject | copper recovery | en |
dc.subject | laminas scrap | en |
dc.subject | thermal treatment | en |
dc.subject | fluidized bed | en |
dc.subject | Engineering, Environmental | en |
dc.subject | Engineering, Civil | en |
dc.subject | Environmental Sciences | en |
dc.title | Degradation products of the process of thermal recovery of copper from lamina scraps in lab-scale fluidized bed reactor | en |
dc.type | journalArticle | en |