Πλοήγηση ανά Θέμα "Three dimensional integrated circuits"
Αποτελέσματα 1-6 από 6
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Abax: 2D/3D legaliser supporting look-ahead legalisation and blockage strategies
(2018)Abax is a modern version of the classical Abacus, minimum displacement, greedy legaliser. Abax supports single-tier 2D or 3D legalisation for multiple, logic-on-logic 3D-IC tiers, efficient look-ahead legalisation of ... -
Investigation and trade-offs in 3DIC partitioning methodologies: N/A
(2019)In this work, we compare alternative 3DIC partitioning methodologies, in terms of slack, number of inter-tier vias, Tier Area Ratio (TAR) and HPWL design parameters. The popular 3DIC postplacement, bin-based Fidducia-Mattheyses ... -
Low power monolithic 3D IC design of asynchronous AES core
(2015)In this paper, we demonstrate, for the first time, that a monolithic 3D implementation of an asynchronous AES encryption core can achieve up to 50.3% footprint reduction, 25.7% improvement in power, 34.3% shorter wirelength ... -
Metal stack and partitioning exploration for monolithic 3D ICs
(2020)In this work, we investigate the effect of metal stack and tier 3D IC partitioning methodologies on the Quality of Results (QoR) of monolithic 3D circuits compared to their 2D counterparts. Two interconnect options are ... -
Near Data Processing Performance Improvement Prediction via Metric-Based Workload Classification
(2022)Contrary to the improvement of CPU capabilities, traditional DRAM evolution faced significant challenges that render it the main performance bottleneck in contemporary systems. Data-Intensive applications such as Machine ... -
A parallel iterative approach for efficient full chip thermal analysis
(2018)Efficient full-chip thermal simulation is among the most challenging problems facing the EDA industry today, especially for modern 3D integrated circuits, due to the huge linear systems resulting from thermal modeling ...